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 VISHAY
TFDU5103
Vishay Semiconductors
Fast Infrared Transceiver Module (MIR, 1.152 Mbit/s) for 2.7 V to 5.5 V Operation
Description
The TFDU5103 is a low-power infrared transceiver module compliant to the latest IrDA physical layer standard for fast infrared data communication, supporting IrDA speeds up to 1.152 Mbit/s (MIR), and carrier based remote control modes up to 2 MHz. The transceiver module consists of a PIN photodiode, an infrared emitter (IRED), and a low-power CMOS control IC to provide a total front-end solution in a single package.
18102
Vishay MIR transceivers are available in different package options, including this BabyFace package (TFDU5103). This wide selection provides flexibility for a variety of applications and space constraints. The transceivers are capable of directly interfacing with a wide variety of I/O devices which perform the modulation/ demodulation function, including National Semiconductor's PC87338, PC87108 and PC87109, SMC's FDC37C669, FDC37N769 and CAM35C44, and Hitachi's SH3. At a minimum, a VCC bypass capacitor is the only external component required implementing a complete solution. TFDU5103 has a tri-state output and is floating in shutdown mode with a weak pull-up.
Features
* Supply voltage 2.7 V to 5.5 V, Operating idle current (receive mode) < 3 mA, Shutdown current < 5 A over full temperature range * Surface Mount Package, top and side view, L 9.7 mm x W 4.7 mm x H 4.0 mm * Operating Temperature - 25 C to 85 C * Storage Temperature - 40 C to 100 C * Transmitter Wavelength typ. 886 nm, supporting IrDA(R) and Remote Control
* IrDA(R) compliant, link distance (MIR) > 1 m, 15 , window losses are allowed to still be inside the IrDA(R) spec. * Remote Control Range > 8 m, 22 m * ESD > 4000 V (HBM), Latchup > 200 mA * EMI immunity > 550 V/m for GSM frequency and other mobile telephone bands / (700 MHz to 2000 MHz, no external shield) * Split power supply, LED can be driven by a separate power supply not loading the regulated supply. U.S. Pat. No. 6,157,476 * Tri-state-Receiver Output, floating in shut down with a weak pull-up * Eye safety class 1 (IEC60825-1, ed. 2001), limited LED on-time, LED current is controlled, no single fault to be considered
Applications
* Notebook Computers, Desktop PCs, Palmtop Computers (Win CE, Palm PC), PDAs * Digital Still and Video Cameras * Printers, Fax Machines, Photocopiers, Screen Projectors * Telecommunication Products
Parts Table
Part TFDU5103-TR3 TFDU5103-TT3 Description Oriented in carrier tape for side view surface mounting Oriented in carrier tape for top view surface mounting 1000 pcs 1000 pcs Qty / Reel
Document Number 82618 Rev. 1.2, 24-Jun-04
www.vishay.com 1
TFDU5103
Vishay Semiconductors Block Diagram
VISHAY
Tri-State Driver Amplifier Comparator
Rxd
Vcc2
Mode SD Txd
Logic &
Control
Controlled Driver
Vcc1
18189
GND
Pin Description
Pin Number 1 Function VCC2 IRED Anode IRED Cathode Txd Description Connect IRED anode directly to VCC2. For voltages higher than 3.6 V an external resistor might be necessary for reducing the internal power dissipation.An unregulated separate power supply can be used at this pin. IRED cathode, internally connected to driver transistor This input is used to transmit serial data when SD is low. An on-chip protection circuit disables the LED driver if the Txd pin is asserted for longer than 80 s. When used in conjunction with the SD pin, this pin is also used to receiver speed mode. Received Data Output, push-pull CMOS driver output capable of driving a standard CMOS or TTL load. No external pull-up or pull-down resistor is required. Floating with a weak pull-up of 500 k (typ.) in shutdown mode. Shutdown, also used for dynamic mode switching. Setting this pin active places the module into shutdown mode. On the falling edge of this signal, the state of the Txd pin is sampled and used to set receiver low bandwidth (Txd = Low, SIR) or high bandwidth (Txd = High, MIR and FIR) mode. Will be overwritten by the mode pin input, which must float, when dynamic programming is used. Supply Voltage HIGH: High speed mode, MIR and FIR; LOW: Low speed mode, SIR only (see chapter "Mode Switching"). Output function: The mode pin can also be used to indicate the dynamically programmed mode. The maximum load is limited to 50 pF. High indicates MIR-, low indicates SIR-mode Ground I O I HIGH I/O Active
2 3
4
Rxd
O
LOW
5
SD
I
HIGH
6 7
VCC1 Mode Mode
8
GND
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Document Number 82618 Rev. 1.2, 24-Jun-04
VISHAY
Pinout
TFDU5103 weight 200 mg
TFDU5103
Vishay Semiconductors
"U" Option BabyFace (Universal)
IRED Detector
Definitions:
In the Vishay transceiver data sheets the following nomenclature is used for defining the IrDA operating modes: SIR: 2.4 kbit/s to 115.2 kbit/s, equivalent to the basic serial infrared standard with the physical layer version IrPhy 1.0 MIR: 576 kbit/s to 1152 kbit/s FIR: 4 Mbit/s VFIR: 16 Mbit/s MIR and FIR were implemented with IrPhy 1.1, followed by IrPhy 1.2, adding the SIR Low Power Standard. IrPhy 1.3 extended the Low Power Option to MIR and FIR and VFIR was added with IrPhy 1.4.A new version of the standard in any case obsoletes the former version.
1
17087
2 34 56
78
Absolute Maximum Ratings
Reference point Ground (Pin 8): unless otherwise noted. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. Parameter Supply voltage range, transceiver Supply voltage range, transmitter Input currents Output sinking current Power dissipation Junction temperature Ambient temperature range (operating) Storage temperature range Soldering temperature Average output current Repetitive pulse output current IRED anode voltage Voltage at all inputs and outputs Vin > VCC1 is allowed Load at mode pin when used as mode indicator < 90 s, ton < 20 % see recommended solder profile (see figure 4) IIRED (DC) IIRED (RP) VIREDA VIN - 0.5 see derating curve, figure 5 PD TJ Tamb Tstg - 25 - 25 Test Conditions 0 V < VCC2 < 6 V 0 V < VCC1 < 6 V for all pins, except IRED anode pin Symbol VCC1 VCC2 Min - 0.5 - 0.5 Typ. Max +6 + 6.5 10 25 500 125 + 85 + 85 240 125 600 + 6.5 5.5 50 Unit V V mA mA mW C C C C mA mA V V pF
Document Number 82618 Rev. 1.2, 24-Jun-04
www.vishay.com 3
TFDU5103
Vishay Semiconductors Eye safety information
Reference point Pin: GND unless otherwise noted. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. Parameter Virtual source size Maximum Intensity for Class 1 Test Conditions Method: (1 - 1/e) encircled energy IEC60825-1 or EN60825-1, edition Jan. 2001 Symbol d Ie Min 2.5 Typ. 2.8
*)
VISHAY
Max
Unit mm
(500)**)
mW/sr
*)Due **)
to the internal limitation measures the device is a "class1" device
IrDA specifies the max. intensity with 500 mW/sr
www.vishay.com 4
Document Number 82618 Rev. 1.2, 24-Jun-04
VISHAY
Electrical Characteristics Transceiver
Tamb = 25 C, VCC = 2.7 V to 5.5 V unless otherwise noted. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. Parameter Supply voltage Dynamic supply current (Idle)
1)
TFDU5103
Vishay Semiconductors
Test Conditions SD = Low, Ee = 0 klx SD = Low, Ee = 1 klx2) SD = High, Mode = Floating Ee = 0 klx SD = High, Mode = Floating Ee = 1 klx2) SD = High, T = 85 C, Mode = Floating, not ambient light sensitive
Symbol VCC ICC ICC ISD ISD ISD
Min 2.7
Typ. 2 2
Max 5.5 3 3 2.0 2.5 5
Unit V mA mA A A A
Dynamic supply current (Idle)1) Shutdown supply current
Operating temperature range Output voltage low Output voltage high Output Rxd current limitation high state Output Rxd current limitation low state Rxd to VCC1 impedance Input voltage low (Txd, SD, Mode) Input voltage high (TxD, SD, Mode) Input leakage current (Txd, SD, Mode) Input leakage current Mode Input capacitance (TxD, SD, Mode) CMOS level 3) TTL level, VCC1 = 4.5 V IOL = 1 mA, Cload = 15 pF IOH = 500 A, Cload = 15 pF IOH = 250 A, Cload = 15 pF Short to Ground Short to VCC1 SD = High
TA VOL VOH VOH
- 25 0.8 x VCC 0.9 x VCC
+ 85 0.4
C V V V
20 20 RRxD VIL VIH VIH IL IICH CIN 400 0.5 VCC - 0.5 2.4 - 10 -2 + 10 +2 5 500 600 0.5 VCC + 0.5
mA mA k V V V A A pF
1) Receive mode only. In transmit mode, add additional 85 mA (typ) for IRED current. Add Rxd output current depending on Rxd load. 2) 3)
Standard Illuminant A
The typical threshold level is between 0.5 x VCC/2 (VCC = 3 V) and 0.4 x VCC (V CC = 5.5 V) . It is recommended to use the specified min/ max values to avoid increased operating current.
Document Number 82618 Rev. 1.2, 24-Jun-04
www.vishay.com 5
TFDU5103
Vishay Semiconductors Optoelectronic Characteristics Receiver
Tamb = 25 C, VCC = 2.7 V to 5.5 V unless otherwise noted. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. Parameter Minimum detection threshold irradiance, SIR mode Minimum detection threshold irradiance, MIR mode Maximum detection threshold irradiance No detection receiver input irradiance Rise time of output signal Fall time of output signal Test Conditions 9.6 kbit/s to 115.2 kbit/s = 850 nm to 900 nm 1.152 Mbit/s = 850 nm to 900 nm = 850 nm to 900 nm
*)
VISHAY
Symbol Ee Ee Ee Ee tr (Rxd) tf (Rxd) tPW tPW
Min
Typ. 25 (2.5) 65 (6.5) 5 (500)
Max 35 (3.5)
Unit mW/m2 (W/cm 2) mW/m2 (W/cm 2) kW/m2 (mW/cm2) mW/m2 (W/cm 2)
4 (0.4) 10 10 1.5 110 1.8 250 40 40 2.1 270
10 % to 90 %, 15 pF 90 % to 10 %, 15 pF
ns ns s ns
Rxd pulse width of output signal, input pulse length 50 % SIR mode 1.4 s < PWopt < 25 s Rxd pulse width of output signal, input pulse length 50 % MIR mode PWopt = 217 ns, 1.152 kbit/s Stochastic jitter, leading edge input irradiance = 100 mW/m2, 1.152 Mbit/s input irradiance = 100 mW/m2, 576 kbit/s input irradiance = 100 mW/m2, 115.2 kbit/s Receiver start up time after completion of shutdown programming sequence Power on delay
40 80 350 500
ns ns ns s
Latency
tL
170
300
s
Note: All timing data measured with 1.152 Mbit/s are measured using the IrDA(R) MIR transmission header.
*)
This parameter reflects the backlight test of the IrDA physical layer specification to guarantee immunity against light from fluorescent lamps
www.vishay.com 6
Document Number 82618 Rev. 1.2, 24-Jun-04
VISHAY
Transmitter
Tamb = 25 C, VCC = 2.7 V to 5.5 V unless otherwise noted. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. Parameter IRED operating current, switched current limiter Test Conditions See derating curve. For 3.3 V operation no external resistor needed. For 5 V application that might be necessary depending on operating temperature range. = 0 , 15 Txd = High, SD = Low, VCC1 = VCC1 = 3.3 V Internally current-controlled, no external resistor VCC1 = 5.0 V, = 0 , 15 Txd = Low or SD = High, (Receiver is inactive as long as SD = High) Symbol ID Min 500 Typ. 550
TFDU5103
Vishay Semiconductors
Max 600
Unit mA
Output leakage IRED current Output radiant intensity recommended appl. circuit
IIRED Ie
-1 120 170
1 350
A mW/sr
Output radiant intensity
Ie
0.04
mW/sr
Output radiant intensity, angle of half intensity Peak - emission wavelength Spectral bandwidth Optical rise time, fall time Optical output pulse duration input pulse width 217 ns, 1.152 kbit/s input pulse width 0.1 s < tTxd < 80 s *) input pulse width tTxd 80 s *) Optical overshoot
*)
p tropt, tfopt topt topt topt 20 10 207 880
24 900 40 40 217 tTxd 85 25 227
nm nm ns ns s s %
Typically the output pulse duration will follow the input pulse duration t and will be identical in length t. However, at pulse durations larger than 80 s the optical output pulse durations is limited to 85 s. This pulse duration limitation can already start at 20 s
Document Number 82618 Rev. 1.2, 24-Jun-04
www.vishay.com 7
TFDU5103
Vishay Semiconductors Recommended Circuit Diagram
Vishay Semiconductors transceivers integrate a sensitive receiver and a built-in power driver. The combination of both needs a careful circuit board layout. The use of thin, long, resistive and inductive wiring should be avoided. The inputs (Txd, SD, Mode) and the output Rxd should be directly (DC) coupled to the I/O circuit.
VISHAY
higher operating voltages and elevated temperatures, see derating curve in figure 7, to avoid too high internal power dissipation. The capacitor C2 combined with the resistor R2 is the low pass filter for smoothing the supply voltage. R2, C1 and C2 are optional and dependent on the quality of the supply voltage VCCx and injected noise. An unstable power supply with dropping voltage during transmission may reduce sensitivity (and transmission range) of the transceiver. The placement of these parts is critical. It is strongly recommended to position C2 as near as possible to the transceiver power supply pins. An Tantalum capacitor should be used for C1 while a ceramic capacitor is used for C2. In addition, when connecting the described circuit to the power supply, low impedance wiring should be used. When extended wiring is used the inductance of the power supply can cause dynamically a voltage drop at VCC2. Often some power supplies are not apply to follow the fast current is rise time. In that case another 4.7 F (type, see table under C1) at VCC2 will be helpful. Keep in mind that basic RF-design rules for circuit design should be taken into account. Especially longer signal lines should not be used without termination. See e.g. "The Art of Electronics" by Paul Horowitz and Winfield Hill, 1989, Cambridge University Press, ISBN: 0521370957.
Test cir cuit
Input Signal - total pulse duration - duty factor tp(tot) = = 0.00
Figure 1. Recommended Application Circuit
The capacitor C1 is buffering the supply voltage and reduces the influence of the inductance of the power supply line. This one should be a Tantalum or other fast capacitor to guarantee the fast rise time of the IRED current. The resistor R1 is only necessary for
Recommended Application Circuit Components
Component C1 C2 R1 Recommended Value 4.7 F, 16 V 0.1 F, Ceramic 5 V supply voltage: 2 , 0.25 W ( recommended using two 1 , 0.125 W resistor in series) 3.3 V supply voltage: no resistor necessary, the internal controller is able to control the current 47 , 0.125 W Vishay Part Number 293D 475X9 016B VJ 1206 Y 104 J XXMT e.g. 2 x CRCW-1206-1R0-F-RT1
R2
CRCW-1206-47R0-F-RT1
www.vishay.com 8
Document Number 82618 Rev. 1.2, 24-Jun-04
VISHAY
I/O and Software
In the description, already different I/Os are mentioned. Different combinations are tested and the function verified with the special drivers available from the I/O suppliers. In special cases refer to the I/ O manual, the Vishay application notes, or contact directly Vishay Sales, Marketing or Application.
TFDU5103
Vishay Semiconductors
After that Txd is enabled as normal Txd input and the transceiver is set for the high bandwidth (576 kbit/s to 1.152 kbit/s) mode.
Setting to the Lower Bandwidth Mode (2.4 kbit/s to 115.2 kbit/s)
1. Set SD input to logic "HIGH". 2. Set Txd input to logic "LOW". Wait ts 200 ns. 3. Set SD to logic "LOW" (this negative edge latches state of Txd, which determines speed setting). 4. Txd must be held for th 200 ns. After that Txd is enabled as normal Txd input and the transceiver is set for the lower bandwidth (9.6 kbit/s to 115.2 kbit/s) mode.
Mode Switching
The TFDU5103 is in the SIR mode after power on as a default mode, therefore the FIR data transfer rate has to be set by a programming sequence using the Txd and SD inputs as described below or selected by setting the Mode Pin. The Mode Pin can be used to statically set the mode (Mode Pin: LOW: SIR, HIGH: 0.576 Mbit/s to 1.152 Mbit/s). If not used or in standby mode, the mode input should float or should not be loaded with more than 50 pF. The low frequency mode covers speeds up to 115.2 kbit/s. Signals with higher data rates should be detected in the high frequency mode. Lower frequency data can also be received in the high frequency mode but with reduced sensitivity. To switch the transceivers from low frequency mode to the high frequency mode and vice versa, the programming sequences described below are required.
SD/Mode
50%
ts Txd 50%
th High : FIR 50% Low : SIR
Setting to the High Bandwidth Mode (0.576 Mbit/s to 1.152 Mbit/s)
1. Set SD input to logic "HIGH". 2. Set Txd input to logic "HIGH". Wait ts 200 ns. 3. Set SD to logic "LOW" (this negative edge latches state of Txd, which determines speed setting). 4. After waiting th 200 ns Txd can be set to logic "LOW". The hold time of Txd is limited by the maximum allowed pulse length.
14873
Figure 2. Mode Switching Timing Diagram
Table 2. Truth table
Inputs SD high low Txd x high high > 80 s low low low Optical input Irradiance mW/m2 x x x <4 > Min. Detection Threshold Irradiance < Max. Detection Threshold Irradiance > Max. Detection Threshold Irradiance Rxd weakly pulled (500 k) to VCC1 low (active) high high low (active) x Outputs Transmitter 0 Ie 0 0 0 0
Document Number 82618 Rev. 1.2, 24-Jun-04
www.vishay.com 9
TFDU5103
Vishay Semiconductors Recommended Solder Profile
Solder Profile for Sn/Pb soldering
VISHAY
Lead-Free, Recommended Solder Profile
The TFDU5103 is a lead-free transceiver and qualified for lead-free processing. For lead-free solder paste like Sn(3.0 - 4.0)Ag(0.5 - 0.9)Cu, there are two standard reflow profiles: Ramp-Soak-Spike (RSS) and Ramp-To-Spike (RTS). The Ramp-Soak-Spike profile was developed primarily for reflow ovens heated by infrared radiation. Shown below in figure 4 is Vishay's recommended profile for use with the TFDU5103 transceivers. For more details please refer to Application note: SMD Assembly Instruction.
240 220 200
Temperature (C)
10 s max. @ 230C 2C - 4C/s
180 160 140 120 100 80 60 40 20 0 0 50 100
120 s - 180 s 2C - 4C/s
90 s max
14874
150
200
250
300
350
Time ( s )
Figure 3. Recommended Solder Profile
280 260 240
Temperature/ C
T = 250C for 20 s max T = 217C for 50 s max
Tpeak = 260C max.
220 200 180 160 140 120 100 80 60 40 20 0 0 50 2C...4C/s
20 s max.
90 s...120 s
50 s max. 2C...4C/s
100
150 Time/s
200
250
300
350
19048
Figure 4. Solder Profile, RSS Recommendation
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Document Number 82618 Rev. 1.2, 24-Jun-04
VISHAY
Current Derating Diagram
Figure 5 shows the maximum operating temperature when the device is operated without external current limiting resistor. A power dissipating resistor of 2 is recommended from the cathode of the IRED to Ground for supply voltages above 4 V. In that case the device can be operated up to 85 C, too.
TFDU5103
Vishay Semiconductors
90
Ambient Temperature ( C)
85 80 75 70 65 60 55 50 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
18097
Operating Voltage [V] @ duty cycle 20%
Figure 5. Temperature Derating Diagram
Document Number 82618 Rev. 1.2, 24-Jun-04
www.vishay.com 11
TFDU5103
Vishay Semiconductors Package Dimensions in mm
VISHAY
7x1=7 0.6
2.5 1 1 8
18470
www.vishay.com 12
Document Number 82618 Rev. 1.2, 24-Jun-04
VISHAY
Reel Dimensions
TFDU5103
Vishay Semiconductors
W1
Reel Hub
W2
14017
Tape Width mm 24
A max. mm 330
N mm 60
W1 min. mm 24.4
W2 max. mm 30.4
W3 min. mm 23.9
W3 max. mm 27.4
Document Number 82618 Rev. 1.2, 24-Jun-04
www.vishay.com 13
TFDU5103
Vishay Semiconductors Tape Dimensions in mm
VISHAY
18269
www.vishay.com 14
Document Number 82618 Rev. 1.2, 24-Jun-04
VISHAY
TFDU5103
Vishay Semiconductors
18283
Document Number 82618 Rev. 1.2, 24-Jun-04
www.vishay.com 15
TFDU5103
Vishay Semiconductors Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements.
VISHAY
2. Regularly and continuously improve the performance of our products, processes, distribution and operatingsystems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.
We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423
www.vishay.com 16
Document Number 82618 Rev. 1.2, 24-Jun-04


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